Applications are being sought for participation in the 4th Annual NSF-sponsored Asia-Pacific Summer School (APSS) in Smart Structures Technology, which will be held July 28th – August 10th, 2011, on the campus of Tongji University, Shanghai, China. The program is open to students currently enrolled in a civil engineering or related graduate program at a US university.
This summer school is aimed at lowering the barriers that currently divide the disciplines required to conduct cutting edge research in smart structures technology through a student oriented international program. APSS will bring graduate students from the US, Korea, Japan, China, and India together for three weeks of focused activities to address gaps in education that are necessary for the advancement of the field. The international approach recognizes the achievements of the participating nations in smart structures technology as well as a common desire to pioneer a structured educational framework. Through this program, participants will be exposed to leaders in the field, both domestic and international. Contact with these faculty, as well as with fellow participants, is intended to inspire students to continue to pursue international collaborative research.
Funds are expected from NSF to support 10 students from US universities. Successful applicants will be provided with:
- - Travel to Shanghai from home university
- - Daily allowance for housing, meals, and other program related travel
- - A $500 stipend
- - Program registration fee
Details regarding eligibility, the application procedure, and the selection process, along with information specific to the US participants is posted at the US program website http://sstl.cee.illinois.edu/apss/. General program information can be found at the Chinese program website, which will be released shortly.